 Semiconductor
Process pw01 |
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| Temperature sensors
directly embedded on wafers enable us to perform direct in-situ |
| Wafer temperature measurement.
Since the sensors are reliable and directly planted on the measured |
| wafer, it can give us actual
temperature at precise locations at which the sensors are planted. |
| By plantin
multiple sensors at different locations on a wafer, we can
also accurately measure temperature |
| profile of the wafer, and continuously
monitor temperature changes of complete thermal cycle including |
| transient states such as ramping
up, cooling down, or delay period. |
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Photo
regist |
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Prober hot plate,
General Process Hot Plate |
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Real time process
monitoring |
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0กษ~250กษ |
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Wafer
size : 2" ~ 12" |
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TC
type : K, R, etc |
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Temperature
range : 0กษ~250กษ |
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Accuracy
: Less than กพ1.0กษ or 0.4% 'K type' |
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Number
of Sensors Available : 1 to 34 points |
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TC
Leads : Sensors thickness. 0.127mm |
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TC
Insulation : 0กษ~250กษ (Teflon Sleeving, Polymide) |
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TC
connectors : 2 - Pin, sub-miniature plugs, D-type
sub miniature (up to 37 pins) |
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U-shape
terminal |
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